CY9481 Zinc Polycrystalline Substrate Zn Substrate 10x10x0.5 mm, SSP

Zinc Polycrystalline Substrate Zn Substrate 10x10x0.5 mm, SSP Description

Manufactured from processed zinc metal, this polycrystalline substrate features a 10x10 mm surface area and a thickness of 0.5 mm. The controlled grain structure is verified through optical microscopy to ensure uniformity essential in subsequent thin-film deposition. Its defined dimensions enable compatibility with standard semiconductor device setups, while the substrate’s inherent material properties serve critical roles in studies involving metal-semiconductor interfaces.

Zinc Polycrystalline Substrate Zn Substrate 10x10x0.5 mm, SSP Applications

Electronics and Semiconductor Manufacturing
- Used as a base layer for thin-film deposition in integrated circuit fabrication to achieve consistent crystallographic alignment by leveraging uniform grain structure.

Industrial Materials Processing
- Applied as a sacrificial layer in microfabrication systems to enable controlled etching processes by providing a uniform dissolution profile in chemical treatments.

Zinc Polycrystalline Substrate Zn Substrate 10x10x0.5 mm, SSP Packing

The substrates are carefully packaged in anti-static pouches and cushioned with foam inserts to prevent mechanical impacts and contamination. They are stored in sealed containers under low humidity conditions to avoid oxidation. Packaging is optimised to reduce particulate exposure during transit. Customisation options, including inert gas sealing and labelled compartmentalisation, are available upon request.

Frequently Asked Questions

Q1: How does the polycrystalline structure of this substrate affect its application in thin-film deposition?
A1: The uniform polycrystalline structure minimises variations in grain boundaries, promoting consistent nucleation and growth during thin-film deposition. This uniformity aids in achieving reproducible electrical and structural properties across fabricated layers.

Q2: What quality control methodologies are applied during substrate production?
A2: Quality control involves systematic surface morphology analysis using optical microscopy and X-ray diffraction to verify grain uniformity and detect structural defects. Such measures ensure substrates meet precise dimensional and compositional standards.

Q3: What are the recommended handling and storage practices post-delivery?
A3: Substrates should be handled using antistatic gloves in a cleanroom environment to prevent contamination. They are best stored in a dry, temperature-controlled space within their original anti-static packaging until use.

Additional Information

Zinc substrates are integral in multiple technological research areas due to their material stability and conductive properties. The processing methods used for polycrystalline substrates focus on achieving controlled grain boundaries, which are critical for subsequent physical and chemical treatments in device fabrication.

Advances in materials science continue to improve the methods for controlling microstructure in metal substrates. Understanding the interplay between processing conditions and crystallographic orientation assists researchers in optimising device performance and exploring new applications in semiconductor and electronic material technologies.