ST11197 Niobium Planar Target, Nb Target

Niobium Planar Target, Nb Target Description

Niobium Planar Target, Nb Target is manufactured from high-purity niobium metal, specifically processed for sputtering applications. Its planar design ensures uniform deposition and compatibility with a wide range of sputtering systems. Customised dimensions cater to various substrate requirements, while controlled material processing minimises internal defects. The target's consistent composition benefits deposition processes in semiconductor and coating applications by improving film uniformity.

Niobium Planar Target, Nb Target Characteristics

*The above product information is based on theoretical data and is for reference only. Actual specifications may vary.

Niobium Planar Target, Nb Target Applications

Electronics
- Used as a sputtering source in semiconductor manufacturing to achieve uniform thin film deposition by leveraging controlled composition, which enhances consistency in electronic device fabrication.

Industrial Processing
- Applied as a coating target in surface engineering systems to improve film adhesion. The controlled niobium purity minimises microstructural defects, contributing to stable process performance.

Research and Development
- Serves as a customisable target in experimental sputtering setups to study deposition parameters. Its verified material properties allow for systematic variation and reliable data collection.

Niobium Planar Target, Nb Target Packing

Niobium Planar Target, Nb Target is packaged in a cushioned, anti-static container to prevent mechanical damage and contamination during transit. The target is wrapped in a protective film and secured within a rigid box. Storage in a low-humidity, temperature-controlled environment is recommended. Custom packaging options, including vacuum sealing and additional labeling, are available to meet specific handling requirements.

Additional Information

Niobium is widely used in sputtering target applications due to its high melting point and chemical inertness. The element's inherent properties facilitate uniform film deposition under various process conditions. Detailed characterisation methods such as XRD and SEM are essential in ensuring that targets meet precise compositional and mechanical requirements.

Advancements in materials science have improved the processing techniques for niobium targets. Enhanced control over purity and surface morphology leads to better reproducibility in thin film deposition processes, which is critical for applications in electronics and coating industries.