CF6861 Epoxy Nomex 410 Paper Laminate

Epoxy Nomex 410 Paper Laminate Description

Epoxy Nomex 410 Paper Laminate is designed for applications requiring mechanical resilience and electrical insulation under thermal stress. The material consists of aramid fiber paper (Nomex 410) impregnated with a modified epoxy resin system, creating a composite that balances flexibility and rigidity. It achieves a glass transition temperature (Tg) of 155°C, ensuring dimensional stability during soldering and thermal cycling, while its thermal class F rating allows continuous operation at 155°C. The laminate’s dielectric strength exceeds 20 kV/mm, with a dissipation factor of 0.02 at 1MHz, making it suitable for high-voltage power electronics. Its moisture absorption rate remains below 0.5% after 24 hours of immersion, preserving dielectric constant (4.2–4.8) and CTI (400V) stability in humid conditions. The material’s tensile strength is 250 MPa, with a flexural modulus of 12 GPa, enabling its use in both rigid and semi-flexible applications. Its coefficient of thermal expansion (CTE) is 18 ppm/°C, aligning with copper foils to reduce thermal stress in PCBs. Surface resistivity and volume resistivity exceed 1×10¹² Ω·cm, ensuring reliable insulation in motor slots and transformers.

Epoxy Nomex 410 Paper Laminate Applications

This laminate is widely used in electrical and electronic systems requiring thermal stability and mechanical durability. In power distribution equipment such as transformers, busbars, and inductors, its thermal class F rating and dielectric strength ensure reliable operation under high currents and thermal cycling. The automotive sector employs it in hybrid motor rotors, stator slots, and DC-DC converter substrates, leveraging its resistance to vibration and thermal shock. Aerospace applications include avionics power supplies and actuator coils, where its lightweight and flame-resistant properties (UL94 V-1 rating) enhance safety. Additionally, the material’s flexibility supports its use in flexible printed circuits (FPCs) for LED lighting and medical devices, where bend radii as tight as 5mm are required.

Epoxy Nomex 410 Paper Laminate Packaging

Our products are packaged in customized cartons of various sizes based on the material dimensions. Small items are securely packed in PP boxes, while larger items are placed in custom wooden crates. We ensure strict adherence to packaging customization and the use of appropriate cushioning materials to provide optimal protection during transportation.

Packaging: Carton, Wooden Box, or Customized.

Kindly review the packaging details provided for your reference.

Manufacturing Process

1.       Testing Method

(1)    Chemical Composition Analysis - Verified using techniques such as GDMS or XRF to ensure compliance with purity requirements.

(2)    Mechanical Properties Testing - Includes tensile strength, yield strength, and elongation tests to assess material performance.

(3)    Dimensional Inspection - Measures thickness, width, and length to ensure adherence to specified tolerances.

(4)    Surface Quality Inspection - Checks for defects such as scratches, cracks, or inclusions through visual and ultrasonic examination.

(5)    Hardness Testing - Determines material hardness to confirm uniformity and mechanical reliability.

Please refer to the SAM testing procedures for detailed information.

Epoxy Nomex 410 Paper Laminate FAQs

Q1. How does its flexibility compare to rigid FR-4?

While FR-4 is rigid, this laminate offers a flexural modulus of 12 GPa, enabling bending to 5mm radii without cracking, making it suitable for flexible printed circuits.

Q2. Can it withstand soldering temperatures?

Yes, it withstands 260°C soldering for 60 seconds with minimal delamination, suitable for through-hole and SMT assembly.

Q3. What is its maximum operating temperature?

The material retains structural integrity up to 155°C, with short-term peak exposure tolerance of 180°C.

Related Information

1.       Common Preparation Methods

The production of Epoxy Nomex 410 Paper Laminate involves a multi-stage process combining aramid fiber paper preparation, resin impregnation, and controlled thermal curing. It begins with Nomex 410 paper, a meta-aramid fiber sheet with a density of 0.2 g/cm³, cut into continuous rolls. The paper is impregnated with a modified epoxy resin system using bisphenol A epoxy resin, phenolic novolac hardener, and a flexibilizing agent (polypropylene glycol) to enhance toughness. Resin content is controlled to 40-45% by weight using a dip-and-squeeze process, ensuring uniform penetration without excessive saturation. The impregnated paper is partially cured in a heated oven at 130-150°C to create a semi-rigid B-stage material. For lamination, multiple plies are stacked with [0/90] orientation and pressed under 5-8 MPa pressure while temperature ramps from 100°C to 160°C over 3 hours, ensuring complete crosslinking and a Tg exceeding 155°C. Post-curing, the laminate undergoes precision shearing, surface grinding, and laser cutting for dimensional accuracy. Quality control involves dielectric breakdown testing (>20 kV/mm), thermal shock cycling (-40°C to 155°C for 50 cycles), and peel strength analysis (>1.5 N/mm) to validate performance across the material’s operational envelope.