Tantal Sputtering Target Description
Stanford Advanced Materials (SAM) supplies Tantalum sputtering targets that meet defined purity standards. These targets are manufactured from Tantalum with a purity of 99.95% to ensure a consistent chemical composition. Tantalum density increases sputtering efficiency and enhances adhesion of deposited layers. Tantalum's thermal stability permits the targets to tolerate high temperatures during sputtering, thereby supporting high-temperature processes. Under sputtering conditions, Tantalum's corrosion resistance preserves target integrity. Low impurity and gas contents in Tantalum contribute to consistent thin film deposition. The material’s machinability allows precise shaping to meet application-specific dimensions. These targets are used for depositing Tantalum layers in electronics, optics, thin-film solar cells and magnetic data storage. They are incorporated in sputter coating processes within the relevant industries.
Specifications for Tantalum Sputtering Targets
|
Part No.
|
Material
|
Size
|
Purity
|
|
TA0201
|
Tantalum
|
1.00" Diameter x 0.125" Thickness
|
99.95%
|
|
TA0202
|
Tantalum
|
1.00" Diameter x 0.250" Thickness
|
99.95%
|
|
TA0203
|
Tantalum
|
2.00" Diameter x 0.125" Thickness
|
99.95%
|
|
TA0204
|
Tantalum
|
2.00" Diameter x 0.250" Thickness
|
99.95%
|
|
TA0205
|
Tantalum
|
3.00" Diameter x 0.250" Thickness
|
99.95%
|
|
TA0206
|
Tantalum
|
3.00" Diameter x 0.250" Thickness
|
99.95%
|
|
TA0207
|
Tantalum
|
4.00" Diameter x 0.250" Thickness
|
99.95%
|
|
TA0208
|
Tantalum
|
4.00" Diameter x 0.250" Thickness
|
99.95%
|
|
TA0209
|
Tantalum
|
5.00" Diameter x 0.250" Thickness
|
99.95%
|
|
TA0210
|
Tantalum
|
5.00" Diameter x 0.250" Thickness
|
99.95%
|
Do you require a tailored solution? Contact us.
We also supply high‐purity Tantalum discs.
Other information for your reference
Chemical Composition:
|
Element
|
R05200 (%, Max)
|
R05400 (%, Max)
|
|
C
|
0.01
|
0.01
|
|
O
|
0.015
|
0.03
|
|
N
|
0.01
|
0.01
|
|
H
|
0.0015
|
0.0015
|
|
Fe
|
0.01
|
0.01
|
|
Mo
|
0.02
|
0.02
|
|
Nb
|
0.1
|
0.1
|
|
Ni
|
0.01
|
0.01
|
|
Si
|
0.005
|
0.005
|
|
Ti
|
0.01
|
0.01
|
|
W
|
0.05
|
0.05
|
Tantalum and Tantalum Alloys
- R05200, unalloyed Tantalum, produced by electron beam furnace or vacuum arc remelting, or both.
- R055400, unalloyed Tantalum, produced by powder metallurgy consolidation.
- R05255, Tantalum alloy comprising 90% Tantalum and 10% Tungsten, produced by electron beam furnace or vacuum arc remelting, or both.
- R05252, Tantalum alloy containing 97.5% Tantalum and 2.5% Tungsten, produced by electron beam or vacuum arc remelting, or both.
- R05240, Tantalum alloy with 60% Tantalum and 40% Niobium, produced by electron beam furnace or vacuum arc remelting.
Applications of Tantalum Sputtering Targets
1. Electronics: Tantalum sputtering targets are used for the deposition of Tantalum layers in integrated circuits, capacitors and other microelectronic components. They meet defined impurity thresholds.
2. Optics: Tantalum sputtering targets are utilised for depositing Tantalum layers on optical components such as lenses and mirrors.
3. Thin-film solar cells: Tantalum sputtering targets are employed in the manufacturing of thin-film solar cells. Deposition of Tantalum layers increases operational efficiency.
4. Magnetic data storage: Tantalum sputtering targets deposit Tantalum layers on magnetic discs and tapes, thereby contributing to meeting performance requirements.
5. Decorative coatings: Tantalum sputtering targets are used for depositing Tantalum films on consumer goods including jewellery and watches.
Tantalum Sputtering Target Packaging
The Tantalum sputtering targets are packaged under controlled conditions to preserve their initial quality during storage and transport.
Safety Data Sheet (MSDS) is provided for your information.
Converters & Calculators
