Graphene Brings IBM Computer Chip Revolution

The IBM research facility has developed a method that increases the production of graphene‐based chips by 10 000 times compared to previous performance. The method applies the electrically conductive material on silicon platforms with improved stability and without the high material loss of traditional processes. It is 100% compatible with existing silicon platforms, which enhances the application process for graphene‐based devices. Given the adoption of technologies that require the specific properties of graphene, the method will reduce and accelerate the material’s associated costs.

Graphene as a technological development

Graphene is the first one‐atom thick, two‐dimensional material. It reduces wear caused by atmospheric influences. It exhibits heat resistance and high electrical conductivity. These properties reduce wear in technological manufacturing. This enables the production of graphene‐based chips and the mass production of solar cells. Previous methods involved depositing graphene layers directly on silicon wafers. Rolling the layers resulted in issues such as distortions, cracks and folds.

The improved method deposits a small amount of graphene on a surface where it subsequently grows. Graphene displays crystalline properties and expands exponentially according to required parameters. The procedure reduces structural impurities significantly and is both time and cost efficient. Electrical currents are passed through the material during growth, thereby increasing process efficiency.

Summary of Findings

IBM research demonstrates that the intrinsic properties of graphene‐based chips maintain a high level of processing performance compared with established chip formats. The material’s resistance to heat and other degrading factors makes it suitable for electronic components. Graphene was initially identified as a replacement for materials previously used in solar panels and superconductors because it is more corrosion resistant. The sole obstacle to mass application was the high cost of production. The new method reduces production time, thereby lowering costs significantly.