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  • What Is Sputtering?

    • What Is Sputtering?

    Last updated on {{lastDate}}

    Sputtering is a process in which a gas plasma dislodges atoms from the surface of a solid Zielmaterials. The atoms subsequently deposit and form a very thin film on the surfaces of substrates. This technique is used to deposit thin films on semiconductors, CDs, hard drives and optical devices. Sputtered films demonstrate uniformity, density, purity and adhesion. Conventional sputtering produces alloys with a precise composition, whereas reactive sputtering is used to create oxides, nitrides and other compounds.

    Process of sputtering:

    1. Ions from an inert gas are accelerated towards the target.
    2. Energy transfer from the ions erodes the target, thereby releasing neutral particles.
    3. Neutral particles from the target migrate and deposit as a thin film on the substrate surface.

    process of sputtering

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    About the author

    Chin Trento

    Chin Trento holds a bachelor's degree in applied chemistry from the University of Illinois. His educational background gives him a broad base from which to approach many topics. He has been working with writing advanced materials for over four years at Stanford Advanced Materials (SAM). His main purpose in writing these articles is to provide a free, yet quality resource for readers. He welcomes feedback on typos, errors, or differences in opinion that readers come across.

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